The electronics industry is moving towards smaller devices with an increasing amount of special features. The smaller the device the more attention should be paid to controlling the excess heat.
Cost Savings Through a Simplified Production Process
Traditionally the silicon-based compounds and glues are used as an intermediate heat conductor from circuit board to metal plate.
When choosing PRETHERM TPE compound instead, the production process will be simplified and accelerated radically; PRETHERM TPE can be co-moulded with metal without using any primers. This results in a competitive advantage by reducing the production costs.
PRETHERM TPE compounds are insulative and non-migrating and can therefore be placed directly into contact with sensitive electronics without the risk of short-circuits.
Tailored properties to meet your wishes
If none of our standard products meet your application requirements we are happy to tailor a special PRETHERM TPE compounds for your demands.