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Materials for Wafer Boxes

Protecting Precision in Semiconductor Logistics

Semiconductor wafers are among the most sensitive and valuable components in modern electronics. Ensuring their safe handling and transport requires packaging materials that combine electrical performance, mechanical durability, and chemical purity. At Premix, we offer two engineered solutions tailored specifically for silicon wafer logistics: wafer container and wafershell materials.

Wafer Container: PRE-ELEC® PP 19997

PRE-ELEC® PP 19997 is a polypropylene-based injection molding compound designed for wafer container applications. Evolved from Premix’s proven ESD box grade PP19161, this new material offers a clean, odorless formulation with no recycled content—ideal for high-purity packaging requirements. With its surface dissipative properties (10⁴ Ω), strong impact resistance, and cost efficiency, PP 19997 is optimized for reliable wafer shipping boxes.

  • No odor (0% recycled content) for cleanroom compatibility
  • Excellent impact strength for mechanical protection
  • Electrically dissipative for ESD protection
  • Easy to process and cost-competitive (2.8 €/kg)

Wafershell: PRE-ELEC® PS 24100

PRE-ELEC® PS 24100 is the first dissipative material in Premix’s polystyrene (PS) portfolio—engineered specifically for wafershell components. With a surface resistivity range of 10⁴–10⁶ Ω, this PS compound delivers the mechanical rigidity, clean processing, and electrostatic safety demanded by semiconductor fabs.

  • Robust flexural modulus (2500 MPa) and tensile strength
  • Tailored surface resistivity for sensitive environments
  • No dilution needed—ready-to-use compound
  • Stable injection molding behavior for tight tolerances

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